技 術 資 料

Technical Date Sheet

PRODUCT HM-28D

耐高溫及阻燃的電子熱熔膠

Hot Melt Adhesine for Electron parts bond, High Heating Resistance and Flame Retardant

用途：適用于熱熔膠槍，用于需求耐高溫和阻燃的電子器材部件和線圈等。

Application：Suitable for Hot Melt Glue Gun, Used In Electron parts or coi.l、Etc。

主要成分COMPOSITION: PP

固體含量SOLID CONTENT:

軟 化 點R&B SOFTENING POINT： 140±10

布氏粘度BROOKFIELD VISCOSITY： 15000±1500mpas

規(guī)格DIMENSION OF THE GRADE： 11.3±0.3 Χ300mm

固化時間SETTING TIME: 6-10sec

外觀Appearance: 白色棒狀 White Glue Stick

特 性： 、符合環(huán)保要求。耐高溫紫外線，阻燃，粘合力強。

Specific Properties: Non-toxic, passed SGS safety, And Environmental . HeatResistance, Resistance to Degradation caused by UV light flameRetardant.

good Adhesion force

使用說明Use introdution:： 建議參考使用 Suggest operating

使用80--120W熱熔膠槍Use 80--120W Hot Melt Glue Gun

儲 存: 存放于陰涼、通風干燥處，可儲存12個月。

STORAGE: Stored in the cool and dry ventilated places. Storage life 12 month.

包 裝： 紙箱

Package: paper box.

注意事項：被粘的電子器件要干凈：受潮或有雜質會影響粘接效果。

Notice: Electron parts must clean. Result from Wet and Impurity, The Adhesion force shall be down.